Thermal interface material, such as thermal pad, thermal grease, thermal paste and phasechange material , are specifically designed with laptop requirements in mind.
LCD module
Cooling tape
Keyboard
Cooling tape
Back cover
Graphite heat sink
Camera module
Heat sink
Heat pipe
Thermal pad
Fan
Thermal pad
Phase change material
Cover
Thermal pad
Thermal tape
Wave-absorbing material
Mainboard
Thermal pad
Battery
New challenges of thermal materials
Low volatility
Low Hardness
Easy to operate
Low thermal resistance
High reliability
Thermal grease for CPU and GPU
| Property | 7W/m·K-- Thermal conductivity 7W/m·K | Low volatility | Low Hardness | Thin thickness |
| Feature | High thermal conductivity | High reliability | Wet contact surface | Thin thickness and low adhesion pressure |
Jojun thermal grease is synthesized by nano-sized powder and liquid silica gel, which has excellent stability and excellent thermal conductivity. It can solve the thermal management problem of heat transfer between interfaces perfectly.
Nvidia GPU Test (Server)
7783/7921-- Japan Shin-etsu 7783/7921
TC5026-- DOW CORNING TC5026
Test Result
| Test Item | Thermal conductivity (W/m ·K) | Fan Speed (S) | Tc(℃) | Ia(℃) | GPU Power(W) | Rca(℃A) |
| Shin-etsu 7783 | 6 | 85 | 81 | 23 | 150 | 0.386 |
| Shin-etsu 7921 | 6 | 85 | 79 | 23 | 150 | 0.373 |
| TC-5026 | 2.9 | 85 | 78 | 23 | 150 | 0.367 |
| JOJUN7650 | 6.5 | 85 | 75 | 23 | 150 | 0.347 |
Test Procedure
Testing environment
| GPU | Nvdia GeForce GTS 250 |
| Power consumption | 150W |
| GPU usage in the test | ≥97% |
| Fan speed | 80% |
| Working Temperature | 23℃ |
| Running time | 15min |
| Testing software | FurMark & MSLKombustor |
Thermal pad for power supply module, solid state drive, north and south bridge chipset, and heat pipe chip.
| Property | Thermal conductivity 1-15 W | Smaller molecule 150PPM | Shoer0010~80 | Oil permeability< 0.05% |
| Feature | Many thermal conductivity options | Low volatility | Low Hardness | Low oil permeability meets high requirements |
Thermal pads are widely used in laptop industry. At present, our company has terminal use cases for 6000 series. Normally, the thermal conductivity is 3~6W/M-K, but the laptop for playing video games has high thermal conductivity requirement of 10~15W/M-K. The normal thicknesses are 25, 0.75, 1.0, 1.5, 1.75, 2.0, etc. (Unit: mm). Comparing with other domestic and foreign factories, our company has rich application experience and coordination ability for laptop, which can meet the fast pace requirements of clients.
Different formulations can meet different needs.
Phase change material for CPU and GPU
| Property | Thermal conductivity 8W/m·K | 0.04-0.06℃ cm2 w | Long chain molecular structure | High temperature resistance |
| Feature | High thermal conductivity | Low thermal resistance & good heat dissipation effect | No migration and no vertical flow | Excellent thermal reliability |
Phase change material is the new thermal conductivity material which can solve the thermal grease loss of laptop CPU, Lenovo- Legion serie of Lenovo used first.
| Sample No. | Overseas brand | Overseas brand | Overseas brand | JOJUN | JOJUN | JOJUN |
| CPU Power(Watt) | 60 | 60 | 60 | 60 | 60 | 60 |
| T cpu(℃) | 61.95 | 62.18 | 62.64 | 62.70 | 62.80 | 62.84 |
| Tc block(℃) | 51.24 | 51.32 | 51.76 | 52.03 | 51.84 | 52.03 |
| T hp1 1(℃) | 50.21 | 50.81 | 51.06 | 51.03 | 51.68 | 51.46 |
| T hp12(℃) | 48.76 | 49.03 | 49.32 | 49.71 | 49.06 | 49.66 |
| T hp13(℃) | 48.06 | 48.77 | 47.96 | 48.65 | 49.59 | 48.28 |
| T hp2_1(℃) | 50.17 | 50.36 | 51.00 | 50.85 | 50.40 | 50.17 |
| T hp2_2(℃) | 49.03 | 48.82 | 49.22 | 49.39 | 48.77 | 48.35 |
| T hp2_3(℃) | 49.14 | 48.16 | 49.80 | 49.44 | 48.98 | 49.31 |
| Ta(℃) | 24.78 | 25.28 | 25.78 | 25.17 | 25.80 | 26.00 |
| T cpu-c block(℃) | 10.7 | 10.9 | 10.9 | 10.7 | 11.0 | 10.8 |
| R cpu-c block(℃/W) | 0.18 | 0.18 | 0.18 | 0.18 | 0.18 | 0.18 |
| T hp1 1-hp1_2(℃) | 1.5 | 1.8 | 1.7 | 1.3 | 2.6 | 1.8 |
| T hp1 1-hp1_3(℃) | 2.2 | 2.0 | 3.1 | 2.4 | 2.1 | 3.2 |
| T hp2 1-hp2_2(℃) | 1.1 | 1.5 | 1.8 | 1.5 | 1.6 | 1.8 |
| T hp2 1-hp2_3(℃) | 1.0 | 2.2 | 1.2 | 1.4 | .4 | 0.9 |
| R cpu-amb.(℃/W) | 0.62 | 0.61 | 0.61 | 0.63 | 0.62 | 0.61 |
Our phase change material VS phase change material of overseas brand, the comprehensive data is roughly equivalent.